This paper reports an in situ Raman study of Cu electrodeposition from an acidic sulfate solution in the presence of bis-(3-sulfopropyl)-disulfide Na salt (SPS). In the absence of chloride, in situ surface-enhanced Raman spectra scarcely show few labile features in a narrow range of cathodic potential. When Cl¯ ions are added to the deposition bath, several features are clearly visible in the spectra, showing that SPS is adsorbed on the copper surface in a wide potential window during Cu electroplating.

Electrodeposition of Cu from Acidic Sulphate Solutions in the Presence of Bis-(3-sulfopropyl)-disulfide (SPS) and chloride ions

BOZZINI, Benedetto;D'URZO, Lucia;ROMANELLO, VINCENZO;MELE, CLAUDIO
2006-01-01

Abstract

This paper reports an in situ Raman study of Cu electrodeposition from an acidic sulfate solution in the presence of bis-(3-sulfopropyl)-disulfide Na salt (SPS). In the absence of chloride, in situ surface-enhanced Raman spectra scarcely show few labile features in a narrow range of cathodic potential. When Cl¯ ions are added to the deposition bath, several features are clearly visible in the spectra, showing that SPS is adsorbed on the copper surface in a wide potential window during Cu electroplating.
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Utilizza questo identificativo per citare o creare un link a questo documento: https://hdl.handle.net/11587/300671
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